This tender is concerning a multi-chamber high vacuum sputtering deposition system for R&D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semicon-ductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized Si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).
Deadline
Fristen for modtagelse af bud var på 2018-10-12.
Indkøbet blev offentliggjort på 2018-09-19.
Objekt Omfanget af udbuddet
Titel: Multi-chamber High Vacuum Sputtering Deposition System (1)
Produkter/tjenester: Måleudstyr📦
Kort beskrivelse:
“This tender is concerning a multi-chamber high vacuum sputtering deposition system for R&D and pi-lot production applications with focus on high flexibility...”
Kort beskrivelse
This tender is concerning a multi-chamber high vacuum sputtering deposition system for R&D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semicon-ductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized Si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).
1️⃣
Yderligere produkter/tjenester: Laboratorieudstyr, optisk udstyr og præcisionsudstyr (ikke briller)📦
Sted for udførelsen: Danmark🏙️
Beskrivelse af udbuddet:
“This tender is concerning a multi-chamber high vacuum sputtering deposition system for R&D and pi-lot production applications with focus on high flexibility...”
Beskrivelse af udbuddet
This tender is concerning a multi-chamber high vacuum sputtering deposition system for R&D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semicon-ductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized Si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).
Vis mere Kriterier for tildeling
Kvalitetskriterium (navn): Quality and functionality
Kvalitetskriterium (vægtning): 55 %
Kvalitetskriterium (navn): Service
Kvalitetskriterium (vægtning): 15 %
Pris (justeringskoefficient): 30 %
Kontraktens, rammeaftalens eller det dynamiske indkøbssystems varighed
Nedenstående tidsramme er udtrykt i antal måneder.
Beskrivelse
Varighed: 24
Oplysninger om valgmuligheder
Indstillinger ✅
Beskrivelse af mulighederne:
“Section ID description weight — Quality points
A5.17 A-Gen 17 In-situ quartz crystal microbalance thickness measurement. Describe solution.
2,75
B5.19 B-Gen...”
Beskrivelse af mulighederne
Section ID description weight — Quality points
A5.17 A-Gen 17 In-situ quartz crystal microbalance thickness measurement. Describe solution.
2,75
B5.19 B-Gen 19 In-situ quartz crystal microbalance thickness measurement. Describe solution.
2,75
Will be evaluated on price alone:
A2.9 A-Vac 9 Chamber bake out: System for chamber bake out during pump down (110 C). Describe solution.
B2.9 B-Vac 9 Chamber bake out: System for chamber bake out during pump down (110 C). Describe solution.
E1.7 4 year service contract 4 year service contract including description of main items to be serviced/replaced and labor time
Juridiske, økonomiske, finansielle og tekniske oplysninger Betingelser for deltagelse
Liste og kortfattet beskrivelse af betingelserne:
“Tenderer holds an official quality management certificate (ISO 9001-2015 or similar). Provide a copy of the certificate (ISO 9001-2015 or similar)” Økonomisk og finansiel stilling
Liste og kortfattet beskrivelse af udvælgelseskriterier:
“The tenderer must state the general yearly turnover and the specific yearly turnover in the business area covered by the contract for the last 3 audited...”
Liste og kortfattet beskrivelse af udvælgelseskriterier
The tenderer must state the general yearly turnover and the specific yearly turnover in the business area covered by the contract for the last 3 audited financial years, and the minimum level for suit-ability is 2 x the contract value calculated as an average of the turnover in the last 3 financial years.
The tenderers must state the profit margin for the last 3 audited financial years, and the Solvency ratio for the last audited financial year.
If the Tenderer can’t state the required figures for economic and financial standing, the Tenderer can document their economic and financial standing by sending an On-demand guarantee with a value of DKK 2 x the contract value.
“Turnover: the minimum level for suitability is 2 x the contract value calculated as an average of the turnover in the last 3 financial years.
All key...”
Turnover: the minimum level for suitability is 2 x the contract value calculated as an average of the turnover in the last 3 financial years.
All key figures must be at least 0.
Vis mere Teknisk og faglig kompetence
Liste og kortfattet beskrivelse af udvælgelseskriterier:
“The Tenderer must give references for comparable contracts. The minimum level for suitability is 3 customer references for each of the 3 requirements below,...”
Liste og kortfattet beskrivelse af udvælgelseskriterier
The Tenderer must give references for comparable contracts. The minimum level for suitability is 3 customer references for each of the 3 requirements below, from contracts that have been fulfilled on time including passing of acceptance tests and references cannot be more than 5 years old.
— documented experience in making cluster-based multi-chamber high vacuum physical vapor deposition systems with a fully automated robotic substrate transfer though central distribution vacuum chamber,
— documented experience in making pulsed DC sputtering,
— documented experience in making High-power impulse magnetron sputtering (HiPIMS).
Vis mere Betingelser for deltagelse
Betingelser for deltagelse (tekniske og faglige kvalifikationer):
“The minimum level for suitability is 3 customer references for each of the 3 requirements stated above.”
Procedure Type af procedure
Åben procedure
Administrative oplysninger
Frist for modtagelse af bud eller ansøgninger om deltagelse: 2018-10-12
12:00 📅
Sprog, på hvilke bud eller ansøgninger om deltagelse kan indgives: dansk 🗣️
Sprog, på hvilke bud eller ansøgninger om deltagelse kan indgives: engelsk 🗣️
Buddet skal være gyldigt indtil: 2019-04-19 📅
Betingelser for åbning af buddene: 2018-10-19
12:00 📅
Supplerende oplysninger Oplysninger om elektroniske arbejdsgange
Der vil blive anvendt elektronisk bestilling
Elektronisk fakturering vil blive accepteret
Der vil blive anvendt elektronisk betaling
Gennemgå organ
Navn: Klagenævnet for Udbud
Postadresse: Nævnenes hus, Toldboden 2
Postby: Viborg
Postnummer: 8800
Land: Danmark 🇩🇰
Telefon: +45 35291000📞
E-mail: klfu@erst.dk📧
URL: http://www.klfu.dk🌏 Gennemgangsprocedure
Præcise oplysninger om fristerne for gennemgangsprocedurer:
“Precise information on deadline(s) for review procedures:
Complaint regarding a decision on shortlisting:
Complaint regarding a decision on shortlisting...”
Præcise oplysninger om fristerne for gennemgangsprocedurer
Precise information on deadline(s) for review procedures:
Complaint regarding a decision on shortlisting:
Complaint regarding a decision on shortlisting must be submitted no later than 20 calendar days from the date after notification to the concerned candidates informing them of who has been selected has been sent and this notification includes the grounds for the decision, cf. law regarding, Complaints board (in danish Klagenævnet for Udbud) § 7, section 1.
Complaint regarding the award of contract:
Complaint regarding the award of contract must be submitted no later than 45 calendar days from the date after the Contracting Authority has published a contract award notice in the European Union Official Journal informing that the Contracting Authority has awarded the contract, cf. Law regarding Complaints board (in danish Klagenævnet for Udbud) § 7, section 2, No. 1.
Complaint regarding the award of a contract under a Framework Agreement with a reopening of the competition:
Complaint regarding the award of a contract under a Framework Agreement with a reopening of the competition must be submitted no later than 30 calendar days form the date after the Contracting Authority has notified the concerned tenderers that a contract has been awarded, if the notification includes the grounds for the decision, cf. Law regarding Complaints board (in danish Klagenævnet for Udbud) § 7, section 2, No. 2.
Complaint regarding the award of a Framework Agreement:
Complaint regarding the award of a Framework Agreement must be submitted no later than 6 months from the date after the Contracting Authority have notified the concerned candidates and tenderers that award of contract has happened, cf. Law regarding the Complaints board (in Danish Klagenævnet for Udbud) § 7, section 2, No. 3.
Complaint regarding direct award of contract:
Complaint regarding the Contracting Authority’s award of contract without prior publication of a contract notice in the European Union Official Journal must be submitted no later than 30 calendar days from the date after a contract award notice has been published by the Contracting Authority in the European Union Official Journal and that contract award notice includes the grounds for the decision to award the contract directly, cf. Law regarding Complaints board (in danish Klagenævnet for Udbud) § 7, section 3.
Compliant regarding public procurements below the EU threshold:
Complaint regarding public procurements below the EU threshold must be submitted no later than 45 calendar days from the date after the Contracting Authority has notified the tenderers about the award of contract if this notification includes the grounds for the decision; and no later than 6 months after the date where the Contracting Authority has notified the candidates and tenderers about that award of a Framework Agreement, if the notification includes the grounds for the decision, cf. Law regarding Complaints board (in danish Klagenævnet for Udbud) § 7, section 4, No. 1 and 2. Compliant regarding a decision on shortlisting on procurement below the EU threshold must be submitted no later than 20 calendar days from the date after the Contracting Authority has sent a notification to the concerned candidates regarding who has been selected and this notification includes the grounds for the decision, cf. Law regarding Complaints board (in danish Klagenævnet for Udbud) § 7, section 5.
Vis mere Tjeneste, hvorfra der kan indhentes oplysninger om klageproceduren
Navn: Konkurrence- og Forbrugerstyrelsen
Postadresse: Carl Jacobsens Vej 35
Postby: Valby
Postnummer: 2500
Land: Danmark 🇩🇰
Telefon: +45 41715000📞
E-mail: kfst@kfst.dk📧
URL: http://www.kfst.dk🌏
Kilde: OJS 2018/S 183-413683 (2018-09-19)
Supplerende oplysninger (2018-10-12) Ordregivende myndighed Navn og adresser
Postby: Kgs Lyngby
Objekt Omfanget af udbuddet
Titel: Multi-Chamber High Vacuum Sputtering Deposition System (1)
Kort beskrivelse:
“This tender is concerning a multi-chamber high vacuum sputtering deposition system for R and D and pi-lot production applications with focus on high...”
Kort beskrivelse
This tender is concerning a multi-chamber high vacuum sputtering deposition system for R and D and pi-lot production applications with focus on high flexibility regarding source materials (metals, semiconductors, and dielectrics), substrate materials and substrate sizes. The system will be used for sputter deposition of various thin films onto standard sized si-wafers (mainly 100 mm and 150 mm) but it should also be possible to load smaller chips using carriers. It should be possible to deposit metal oxides, metal nitrides, and pure metal thin films and semiconductors in various sputtering modes (DC/RF/pulsed DC/HiPIMS/reactive sputtering).
Supplerende oplysninger Oprindelig reference til meddelelsen
Meddelelsesnummer i EUT S: 2018/S 183-413683
Ændringer Tekst, der skal berigtiges i den oprindelige meddelelse
Afsnittets nummer: IV.2.2)
Sted for den tekst, der skal ændres: Time limit for receipt of tenders or requests to participate
Gammel værdi
Dato: 2018-10-12 📅
Tid: 12:00
Ny værdi
Dato: 2018-10-24 📅
Tid: 12:00
Kilde: OJS 2018/S 203-462280 (2018-10-12)